Charles Cohn

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Mr. Charles Cohn is a Senior Analyst with TechSearch International, Inc. a consulting company that provides technical and marketing analysis to the semiconductor packaging and assembly industry. Concurrently, Mr. Cohn also provides technical assistance and market strategies to Japan Circuit Industrial Co., Ltd. (JCI), a leading edge manufacturer of high density printed wiring board substrates for the semiconductor industry. Prior to joining TechSearch International and JCI, Mr. Cohn was a Distinguished Member of the Technical Staff (DMTS) in the IC Packaging and Interconnection Organization at Agere Systems (Currently LSI).  He has been with AT&T / Lucent / Agere for 23 years, as the lead resource on PCB technology, supporting the development of advanced organic PBGA substrates for wire bonded and flip-chip IC interconnections. He maintained close relationships with a broad spectrum of organic substrate suppliers world wide to continually assess their latest technologies and manufacturing capabilities.  He has authored chapters in several McGraw Hill, IC Packaging Handbooks, co-edited a McGraw Hill book titled “Failure-Free IC Packages”, conducted many seminars and presented numerous papers on electronic packaging.  He was awarded 9 US Patents and 2 Patents Pending on IC Packaging Construction and Thermal Enhancements. Mr. Cohn holds BS, MS & ME degrees in mechanical engineering from Columbia University and has a New Jersey Professional Engineering License. 

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